Die Attach Curing Program Automation of N2 Parameter for Process Robustness
نویسندگان
چکیده
منابع مشابه
Die Attach for High Temperature Electronics Packaging
AuSi, patterned Au and off-eutectic Sn-Au-Sn die attach materials and processes have been investigated for SiC die attach for high temperature applications. AuSi shear test results after 3000 hours of aging at 325C in air showed only a slight decrease in shear strength when assembled on Mo:Mn/Pd/Au metallized AlN. However, when assembled on Mo:Mn/Ni/Au metallized AlN, the die shear strength dec...
متن کاملEffect of Die Bonding Condition for Die Attach Film Performance in 3D QFN Stacked Die
Consumer demand for smaller and lighter products in wiresless application with maximum functionality had drive the semiconductor industries toward the developement of 3-dimensional stacked die. One of the key technology is relies on die stacking process. A suitable bonding condition and material set are essential to achieve required reliability performance. This study is to relate the effects o...
متن کاملDie Attach Film Performance in 3D QFN Stacked Die
Consumer demand for smaller and lighter products in wiresless application with maximum functionality had drive the semiconductor industries toward the developement of 3-dimensional stacked die. One of the key technology is relies on die stacking process. A suitable bonding condition and material set are essential to achieve required reliability performance. This study is to relate the effects o...
متن کاملSelecting Die Attach Technology for High-Power Applications Page of
From a packaging perspective, there are a number of common requirements for all these highpower applications: they must handle high electrical currents, dissipate large amounts of heat, manage thermal expansion-induced stresses for high reliability, and this must all be accomplished at low cost. Cost, in this case, includes assembly as well as materials. ROHS regulations also add some new dimen...
متن کاملFluxless Die Attach by Activated Forming Gas
Eutectic god-tin (Au80Sn20) is widely used as the die-attach material for making radio-frequency (RF) and microwave devices. The metallic bonding is typically achieved by soldering using a gold-tin preform in a forming gas containing hydrogen (H2) and nitrogen (N2) to a peak temperature at 300 ̊C. The performance and reliability of the devices are strongly dependent on the quality of the die-att...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Journal of Engineering Research and Reports
سال: 2021
ISSN: 2582-2926
DOI: 10.9734/jerr/2021/v20i417304